View HSP061-4M10_7176232.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

this is information on a product in full production. september 2012 doc id 023716 rev 2 1/11 11 HSP061-4M10 4-line esd protection for high speed lines datasheet ? production data features flow-through routing to keep signal integrity ultralarge bandwidth: 8.7 ghz ultralow capacitance: 0.3 pf low leakage current: 70 na at 25 c extended operating junction temperature range: -40 c to 150 c thin package: 0.5 mm max. rohs compliant benefits high esd robustness of the equipment suitable for high density boards complies with following standards mil-std 883g method 3015-7 class 3b: ?8 kv iec 61000-4-2 level 4: ? 8 kv (contact discharge) ? 15 kv (air discharge) applications the HSP061-4M10 is designed to protect against electrostatic discharge on sub micron technology circuits driving: hdmi 1.3 and 1.4 digital video interface display port usb 3.0 serial ata thunderbolt figure 1. functional schematic (top view) description the HSP061-4M10 is a 4-channel esd array with a rail to rail architecture designed specifically for the protection of high speed differential lines. the ultralow variation of the capacitance ensures very low influence on signal-skew. the large bandwidth makes the device compatible with 3.4 gbps. the device is packaged in qfn-10l 2.5 x 1 mm with a 500 m pitch, which minimizes the pcb area. qfn-10l package i/o 1 i/o 2 gnd i/o 3 i/o 4 internally not connected gnd internally not connected 1 2 4 5 6 8 9 10 3 7 www.st.com
characteristics HSP061-4M10 2/11 doc id 023716 rev 2 1 characteristics table 1. absolute maximum ratings t amb = 25 c symbol parameter value unit v pp peak pulse voltage iec 61000-4-2 contact discharge iec 61000-4-2 air discharge 8 20 kv t j operating junction temperature range -40 to +150 c t stg storage temperature range -65 to +150 c t l maximum lead temperature for soldering during 10 s 260 c table 2. electrical characteristics t amb = 25 c symbol parameter test conditions min. typ. max. unit v br breakdown voltage i r = 1 ma 6 v i rm leakage current v rm = 3 v 70 na v cl clamping voltage ipp = 1 a, 8/20 s 15 v c i/o - i/o capacitance (i/o to i/o) v i/o = 0 v, f = 1 mhz, v osc = 30 mv 0.3 0.4 pf c i/o - gnd capacitance (i/o to gnd) v i/o = 0 v f = 1 mhz, v osc = 30 mv 0.6 0.8 pf f c cut-off frequency -3db 8.7 ghz z diff differential impedance t r = 200 ps (10 - 90%) (1) , z 0 diff = 100 ? 1. hdmi specification conditions. this information can be provided for othe r applications. pl ease contact your local st office. 85 100 115 ?
HSP061-4M10 characteristics doc id 023716 rev 2 3/11 figure 2. leakage current versus junction temperature (typical values) figure 3. s21 attenuation measurement i r (na) 0,01 0,1 1 10 25 50 75 100 125 150 t j (c) v r =v rm =3v 100k 1m 10m 100m 1g 10g -5 -4 -3 -2 -1 0 s21 (db) f (hz) figure 4. differential impedance (z diff ) (1) figure 5. eye diagram - hdmi mask at 3.4 gbps per channel (1) 1. hdmi specification conditions. this information can be provided for other applic ations. please contact y our local st office. tr = 200 ps (10% - 90%) 12.5 /div 250 mv/div 50 ps/div figure 6. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 7. esd response to iec 61000-4-2 (-8 kv contact discharge) 20 v/div 112 v 27 v 20 v 20 ns/div v : esd peak voltage pp v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl 1 1 2 2 3 3 20 v/div -119 v -16 v -11 v 20 ns/div v : esd peak voltage pp v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl 1 1 2 2 3 3
ordering information scheme HSP061-4M10 4/11 doc id 023716 rev 2 2 ordering information scheme figure 8. ordering information scheme hsp 06 1 - 4 m10 high speed line protection breakdown voltage version number of lines package qfn-10l
HSP061-4M10 package information doc id 023716 rev 2 5/11 3 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 3. qfn-10l dimensions ref dimensions millimeters inches min typ max min typ max a 0.40 0.48 0.50 0.018 0.019 0.020 a1 0.00 0.03 0.05 0.00 0.001 0.002 a2 0.13 0.005 b 0.15 0.20 0.30 0.006 0.008 0.012 b1 0.35 0.40 0.45 0.014 0.016 0.041 d 2.40 2.50 2.60 0.094 0.098 0.102 e 0.9 1.00 1.10 0.035 0.039 0.043 e 0.50 0.206 l 0.30 0.38 0.425 0.012 0.015 0.017 figure 9. footprint recommendations (dimensions in mm) figure 10. marking a a1 a2 pin 1 id l r 0.125 d b1 e b e 1 10 6 5 seating plane 0.58 0.50 0.40 0.20 2.20 1.40 h 4 m
package information HSP061-4M10 6/11 doc id 023716 rev 2 figure 11. qfn-10l tape and reel specification dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 12.0 1.75 5.5 ? 1.55 0.60 1.25 0.30 2.75 h4m h4m h4m
HSP061-4M10 recommendation on pcb assembly doc id 023716 rev 2 7/11 4 recommendation on pcb assembly figure 12. recommended stencil window position 4.1 solder paste 1. use halide-free flux, qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste recommended. 3. offers a high tack force to resist component displacement during pcb movement. 4. use solder paste with fine particles: powder particle size 20-45 m. stencil window footprint copper thickness: 100 m 200 m 190 m 15 m 15 m 5 m 5 m 15 m 15 m 400 m 380 m 10 m 10 m 550 m 550 m 580 m 580 m
recommendation on pcb assembly HSP061-4M10 8/11 doc id 023716 rev 2 4.2 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.3 pcb design 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. figure 13. printed circuit board layout recommendations via to gnd via to gnd 500 m footprint pad pcb tracks 1 5 6 10
HSP061-4M10 recommendation on pcb assembly doc id 023716 rev 2 9/11 4.4 reflow profile figure 14. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. maximum soldering profile corresponds to the latest ipc/jedec j-std-020. 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 - 6c/s 240-245 c 2 - 3 c/s temperature (c) -2 c/s -3 c/s time (s) 0.9 c/s 60 sec (90 max)
ordering information HSP061-4M10 10/11 doc id 023716 rev 2 5 ordering information 6 revision history table 4. ordering information order code marking package weight base qty delivery mode HSP061-4M10 h4m qfn-10l 3.27 mg 3000 tape and reel table 5. document revision history date revision changes 05-sep-2012 1 initial release. 18-oct-2012 2 updated v pp in ta b l e 1 .
HSP061-4M10 doc id 023716 rev 2 11/11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2012 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

▲Up To Search▲

Price & Availability of HSP061-4M10

	To Download HSP061-4M10 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .